EVALUATION KIT AVAILABLE MAX16813 Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller and Battery Disconnect General Description Benefits and Features The MAX16813 high-efficiency, high-brightness LED (HB 4-Channel Linear LED Current Sinks with Internal LED) driver provides four integrated LED current-sink MOSFETs Independently Drive Multiple LED Strings channels. An integrated current-mode switching control- Full-Scale LED Current Adjustable from 20mA ler drives a DC-DC converter that provides the neces- to 150mA sary voltage to multiple strings of HB LEDs. The device Drives 1 to 4 LED Strings 10000:1 PWM Dimming at 200Hz accepts a wide 4.75V to 40V input voltage range and withstands direct automotive load-dump events. The Flexible Current-Mode Architecture Supports a Wide wide input range allows powering HB LEDs for small- to Range of Applications While Minimizing Interference medium-sized LCD displays in automotive and general Boost or SEPIC Current-Mode DC-DC Controller lighting applications. 200kHz to 2MHz Programmable Switching Frequency An internal current-mode switching DC-DC controller supports boost or SEPIC topologies and operates in an External Switching-Frequency Synchronization Spread-Spectrum Mode adjustable frequency range between 200kHz and 2MHz. An integrated spread-spectrum mode helps reduce EMI. Protection Features Enhance Fault Detection and Current-mode control with programmable slope compen- System Reliability sation provides fast response and simplifies loop compen- Output-to-Ground Undervoltage Protection sation. An adaptive output-voltage control scheme mini- Open-Drain Fault-Indicator Output mizes power dissipation in the LED current-sink paths. Open-LED and LED-Short Detection and The device has a separate p-channel drive (PGATE) pin Protection that is used for output undervoltage protection. Whenever Overtemperature Protection the output falls below the threshold, the external Adaptive Output-Voltage Optimization to Minimize p-MOSFET is latched off, disconnecting the input source. Power Dissipation Cycling the EN or the input supply is required to restart Less than 2A Shutdown Current the converter. The external p-MOSFET is off when the EN pin is below 0.3V (typ). The shutdown current is 1A (typ) Applications at an input voltage of 12V. Automotive Displays LED Backlights The device consists of four identical linear current-sink Automotive RCL, DRL, Front Position, and Fog Lights channels, adjustable from 20mA to 150mA with an LCD TV and Desktop Display LED Backlights accuracy of 3% using a single external resistor. Multiple Architectural, Industrial, and Ambient Lighting channels can be connected in parallel to achieve higher current per LED string. The device also features a unique pulsed dimming control through a logic input (DIM), Ordering Information with minimum pulse width as low as 500ns. Protection features include output overvoltage, open-LED detection PART TEMP RANGE PIN-PACKAGE and protection, programmable shorted LED detection and MAX16813ATP+ -40C to +125C 20 TQFN-EP* protection, output undervoltage protection and detection, MAX16813ATP/V+ -40C to +125C 20 TQFN-EP* and overtemperature protection. The device operates MAX16813AUP+ -40C to +125C 20 TSSOP-EP* over the -40C to +125C automotive temperature range. MAX16813AUP/V+ -40C to +125C 20 TSSOP-EP* The MAX16813 is available in 20-pin (6.5mm x 4.4mm) +Denotes a lead(Pb)-free/RoHS-compliant package. TSSOP and 20-pin (4mm x 4mm) TQFN packages. *EP = Exposed pad. /V denotes an automotive qualified part. 19-6713 Rev 4 3/16MAX16813 Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller and Battery Disconnect Absolute Maximum Ratings IN to SGND ...........................................................-0.3V to +45V OUT Continuous Current..............................................175mA EN, PGATE to SGND ...................................-0.3V to (IN + 0.3V) V Short-Circuit Duration ........................................Continuous CC PGND to SGND.................................................... -0.3V to +0.3V Continuous Power Dissipation (T = +70C) (Note 1) A LEDGND to SGND ...............................................-0.3V to +0.3V 20-Pin TQFN (derate 25.6mW/C above +70C) ......2051mW OUT to LEDGND .................................................-0.3V to +45V 20-Pin TSSOP (derate 26.5mW/C above +70C) ....2122mW V to SGND ............-0.3V to the lower of (IN + 0.3V) and +6V Operating Temperature Range ......................... -40C to +125C CC FLT, DIM, RSDT, OVP to SGND .............................-0.3V to +6V Junction Temperature ......................................................+150C CS, NDRV, RT, COMP, SETI to SGND .... -0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C CC NDRV Peak Current (< 100ns) .............................................3A Lead Temperature (soldering, 10s) .................................+300C NDRV Continuous Current .............................................100mA Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TQFN TSSOP Junction-to-Ambient Thermal Resistance ( ) ........+39C/W Junction-to-Ambient Thermal Resistance ( ) .....+37.7C/W JA JA Junction-to-Case Thermal Resistance ( ) ...............+6C/W Junction-to-Case Thermal Resistance ( ) ............+2.0C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = V = 12V, R = 12.25k, R = 15k, C = 1F, NDRV = COMP = OUT = PGATE = unconnected, V = V = IN EN RT SETI VCC RSDT DIM V , V = 0.7V, V = V = V = V = 0V, T = T = -40C to +125C, unless otherwise noted. Typical values are CC OVP CS LEDGND PGND SGND A J at T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS SUPPLIES Operating Voltage Range V 4.75 40 V IN V = 1.266V, all channels on, OVP Supply Current I 3.4 5.7 mA IN V = 0.5V OUT Standby Supply Current I V = 0V 1 2 A IN Shdn EN IN Undervoltage Lockout V rising 3.975 4.3 4.625 V IN IN UVLO Hysteresis 170 mV V REGULATOR CC 6.5V < V < 10V, 1mA < I < 50mA 4.75 5 5.25 IN LOAD Regulator Output Voltage V V CC 10V < V < 40V, 1mA < I < 10mA 4.75 5 5.25 IN LOAD Dropout Voltage V - V , V = 4.75V, I = 50mA 200 500 mV IN CC IN LOAD Short-Circuit Current Limit V V shorted to SGND 100 mA CC ILIM CC V Undervoltage-Lockout CC V rising 4 V CC Threshold V UVLO Hysteresis 125 mV CC Maxim Integrated 2 www.maximintegrated.com