Product Information

DS8024-RJX+T&R

DS8024-RJX+T&R electronic component of Analog Devices

Datasheet
Interface - Specialized Smart Card Interface

Manufacturer: Analog Devices
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Price (AUD)

1: AUD 9.4177 ( AUD 10.36 Inc GST) ea
Line Total: AUD 9.4177 ( AUD 10.36 Inc GST)

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 26 Jul to Tue. 30 Jul

MOQ : 1
Multiples : 1

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DS8024-RJX+T&R
Analog Devices

1 : AUD 9.4177
10 : AUD 6.68
25 : AUD 6.3
100 : AUD 5.46
250 : AUD 4.9808
500 : AUD 4.4808
1000 : AUD 4.0192
2000 : AUD 3.8846

     
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DS8024 Smart Card Interface General Description Features The DS8024 smart card interface IC is a low-cost, analog Analog Interface and Level Shifting for IC Card front-end for a smart card reader, designed for all ISO Communication 7816, EMV , and GSM11-11 applications. The DS8024 8kV (min) ESD (IEC) Protection on Card is a pin-for-pin drop-in replacement for the NXP Interfaces TDA8024 and is offered in 28-pin TSSOP and SO pack- ages. Internal IC Card Supply-Voltage Generation: Applications requiring support for 1.8V smart cards or 5.0V 5%, 80mA (max) requiring low power should consider the DS8113, which 3.0V 8%, 65mA (max) achieves lower active- and stop-mode power with mini- Automatic Card Activation and Deactivation mal changes to application hardware and software. Controlled by Dedicated Internal Sequencer I/O Lines from Host Directly Level Shifted for Applications Smart Card Communication Set-Top Box Conditional Access Flexible Card Clock Generation, Supporting Access Control External Crystal Frequency Divided by 1, 2, 4, or 8 Banking Applications High-Current, Short-Circuit and High-Temperature POS Terminals Protection Debit/Credit Payment Terminals PIN Pads Pin Configuration Automated Teller Machines Telecommunications TOP VIEW Pay/Premium Television CLKDIV1 1 28 AUX2IN Ordering Information CLKDIV2 2 27 AUX1IN 5V/3V 3 26 I/OIN PART TEMP RANGE PIN-PACKAGE PGND 4 25 XTAL2 DS8024-RJX+ -40C to +85C 28 TSSOP CP2 5 24 XTAL1 DS8024-RJX/V+ -40C to +85C 28 TSSOP V 6 23 OFF DDA DS8024 DS8024-RRX+ -40C to +85C 28 SO CP1 7 22 GND Note: Contact the factory for availability of other variants and V 8 21 V UP DD package options. +Denotes a lead(Pb)-free/RoHS-compliant package. PRES 9 20 RSTIN /V denotes an automotive-qualified part. PRES 10 19 CMDVCC I/O 11 18 N.C. AUX2 12 17 V CC AUX1 13 16 RST Selector Guide appears at end of data sheet. CGND 14 15 CLK SO/TSSOP EMV is a registered trademark of EMVCo LLC. EMV Level 1 library and hardware reference design available. Contact factory for details. Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, go to: www.maximintegrated.com/errata. For pricing, delivery, and ordering information, please contact Maxim Direct 19-6220 Rev 4 4/13 at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com.DS8024 Smart Card Interface ABSOLUTE MAXIMUM RATINGS Voltage Range on V Relative to GND ...............-0.5V to +6.5V Continuous Power Dissipation (multilayer board, T = +70C) DD A Voltage Range on V Relative to PGND ...........-0.5V to +6.5V TSSOP (derate 14mW/C above +70C) .................1117.3mW DDA Voltage Range on CP1, CP2, and V SO (derate 16.7mW/C above +70C).....................1355.9mW UP Relative to PGND...............................................-0.5V to +7.5V Storage Temperature Range .............................-55C to +150C Voltage Range on All Other Pins Lead Temperature (soldering, 10s) .................................+300C Relative to GND......................................-0.5V to (V + 0.5V) Soldering Temperature (reflow) .......................................+260C DD Maximum Junction Temperature .....................................+125C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED DC OPERATING CONDITIONS (V = +3.3V, V = +5.0V, T = +25C, unless otherwise noted.) (Note 1) DD DDA A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Digital Supply Voltage V 2.7 6.0 V DD V = 5V, I < 80mA 4.0 6.0 CC CC Card Voltage-Generator Supply Voltage V V DDA V = 5V, I < 30mA 3.0 6.0 CC CC V Threshold voltage (falling) 2.30 2.45 2.60 V TH2 Reset Voltage Thresholds V Hysteresis 50 100 150 mV HYS2 CURRENT CONSUMPTION Active V Current 5V Cards I = 80mA, f = 20MHz, DD CC XTAL I 215 mA DD 50V (Including 80mA Draw from 5V Card) f = 10MHz, V = 5.0V CLK DDA Active V Current 5V Cards I = 80mA, f = 20MHz, DD CC XTAL I 135 mA DD IC (Current Consumed by DS8024 Only) f = 10MHz, V = 5.0V (Note 2) CLK DDA Active V Current 3V Cards I = 65mA, f = 20MHz, DD CC XTAL I 100 mA DD 30V (Including 65mA Draw from 3V Card) f = 10MHz, V = 5.0V CLK DDA Active V Current 3V Cards I = 65mA, f = 20MHz, DD CC XTAL I 35 mA DD IC (Current Consumed by DS8024 Only) f = 10MHz, V = 5.0V (Note 2) CLK DDA Inactive-Mode Current I Card inactive 500 A DD CLOCK SOURCE Crystal Frequency f External crystal 0 20 MHz XTAL f 0 20 MHz XTAL1 0.3 x V Low-level input on XTAL1 (Note 3) -0.3 IL XTAL1 V XTAL1 Operating Conditions DD V 0.7 x V + DD V High-level input on XTAL1 (Note 3) IH XTAL1 V 0.3 DD C , XTAL1 External Capacitance for Crystal (Note 3) 15 pF C XTAL2 Internal Oscillator f 2.7 MHz INT SHUTDOWN TEMPERATURE Shutdown Temperature T (Note 3) +150 C SD 2 Maxim Integrated

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Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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