ASFC8G31M-51BIN Revision History 8GB eMM C 153ball FBGA PACKAGE Revision Details Date Rev 1.0 Initial Release Dec. 2021 Confidential -139- Rev.1.0 December 2021ASFC8G31M-51BIN CONTENTS 1 Product Overview ............................................................................................................................................ 5 1.1 Product Description .................................................................................................................................................... 5 1.2 Product Ordering Information .................................................................................................................................. 5 1.3 Key Features ................................................................................................................................................................ 6 2 Package Information ........................................................................................................................................ 7 2.1 Package Dimension ..................................................................................................................................................... 7 2.2 Ball & Signal Assignment ............................................................................................................................................. 8 2.3 Product Architecture ................................................................................................................................................. 10 3 Technical Notes .............................................................................................................................................. 11 3.1 HS400 Interface ......................................................................................................................................................... 11 3.2 Partition Management .............................................................................................................................................. 11 3.2.1 Boot Area Partition and RPMB Area Partition ................................................................................................... 11 3.2.2 Enhanced Partition (Area) .................................................................................................................................. 12 3.2.3 User Density ....................................................................................................................................................... 12 3.3 Boot operation .......................................................................................................................................................... 12 3.4 Field Firmware Upgrade (FFU) .................................................................................................................................. 14 3.5 Cache ......................................................................................................................................................................... 14 3.6 Packed Commands .................................................................................................................................................... 14 3.7 Secure Delete ............................................................................................................................................................ 14 3.7.1 Sanitize ............................................................................................................................................................... 14 3.7.2 Secure Erase ....................................................................................................................................................... 14 3.7.3 Secure Trim ........................................................................................................................................................ 14 3.8 High Priority Interrupt (HPI) ...................................................................................................................................... 15 3.9 Device Health ............................................................................................................................................................ 15 3.10 Auto Power Saving Mode ........................................................................................................................................ 15 3.11 Enhanced Strobe ..................................................................................................................................................... 16 3.12 Performance ........................................................................................................................................................... 16 4 Register Value ................................................................................................................................................. 17 4.1 OCR Register ............................................................................................................................................................. 17 4.2 CID Register ............................................................................................................................................................... 17 4.2.1 Product name table (In CID Register) ................................................................................................................. 18 4.3 RCA Register .............................................................................................................................................................. 19 4.4 CSD Register .............................................................................................................................................................. 19 Confidential -239- Rev.1.0 December 2021