INCH-POUND
The documentation and process conversion measures
necessary to comply with this document shall be
MIL-PRF-19500/391P
completed by 26 September 2015.
26 June 2015
SUPERSEDING
MIL-PRF-19500/391N
20 May 2014
PERFORMANCE SPECIFICATION SHEET
* TRANSISTOR, NPN, SILICON, LOW-POWER, ENCAPSULATED
(THROUGH-HOLE AND SURFACE MOUNT), AND UNENCAPSULATED,
RADIATION HARDNESS ASSURANCE, DEVICE TYPES 2N3019, 2N3057A, AND 2N3700,
QUALITY LEVELS JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for NPN, silicon, low-power transistors. Four
levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product
assurance are provided for the unencapsulated device types 2N3019 and 2N3700. Radiation hardness assurance
(RHA) level designators M, D, P, L, R, F, G and H are appended to the device prefix to identify devices,
which have passed RHA requirements.
* 1.2 Package outlines and die topography. The device packages for the encapsulated device types are as follows:
TO-5 in accordance with figure 1, TO-39 in accordance with figure 2, TO-18 in accordance with figure 3, and surface
mount versions UB in accordance with figure 4. The dimensions and topography for JANHC and JANKC
unencapsulated die are as follows: A version die in accordance with figure 5, B version die in accordance with figure
6, and C version die in accordance with figure 7.
1.3 Maximum ratings. Unless otherwise specified, T = +25C.
A
I V V V T and T
C CBO EBO CEO J STG
A dc V dc V dc V dc
C
1 140 7 80
-65 to +200
Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime, ATTN:
VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dla.mil. Since contact
information can change, you may want to verify the currency of this address information using the ASSIST Online
database at MIL-PRF-19500/391P
1.3 Maximum ratings. Unless otherwise specified, T = +25C. - Continued.
A
Types
P P P R R R
T T T
JA JC JSP(IS)
T = +25C (2) (3) (4) (2) (3) (2) (3)
T = +25C T = +25C
SP(IS)
A C
(1) (2)
(1) (2) (1) (2)
W W W C/W C/W C/W
2N3019 0.800 5 N/A 195 30 N/A
2N3019S 0.800 5 N/A 195 30 N/A
2N3057A 0.500 1.8 N/A 325 80 N/A
2N3700 0.500 1 N/A 325 150 N/A
2N3700UB 0.500 N/A 1.5 325 N/A 90
(1) For derating, see figures 8, 9, 10, 11, 12, and 13.
(2) See 3.3.
(3) For thermal curves, see figures 14, 15, 16, 17, 18, 19, and 20.
(4) For non-thermal conductive PCB or unknown PCB surface mount conditions in free air, substitute figures 8 and
.
12 for the UB package and use R
JA
1.4 Primary electrical characteristics.
Limits
h h h (1) h (1)
FE1 FE2 FE4
FE3
V = 10 V dc V = 10 V dc V = 10 V dc V = 10 V dc
CE CE CE CE
I = 150 mA dc I = 0.1 mA dc I = 10 mA dc I = 500 mA dc
C C C C
Min 100 50 90 50
Max 300 300 300
Types Limit C
obo
h (1) |h |
FE5 fe
100 kHz f 1 MHz
f = 20 MHz
V = 10 V dc
CE
= 10 V dc
V = 10 V dc VCB
CE
I = 1 A dc
C
I = 0
I = 50 mA dc E
C
2N3019, 2N3019S pF
2N3057A, 2N3700
2N3700UB
Min 15 5
Max 20 12
Types Limits
VCE(sat)1 (1) VCE(sat)2 (1) VBE(sat) (1)
I = 150 mA dc I = 500 mA dc I = 150 mA dc
C C C
I = 15 mA dc I = 50 mA dc I = 15 mA dc
B B B
2N3019, 2N3019S V dc V dc V dc
2N3057A, 2N3700
2N3700UB
Min
Max 0.2 0.5 1.1
(1) Pulsed, see 4.5.1.
2