Description The SiPM Direct Time of Flight (dToF) LiDAR Platform is www.onsemi.com a complete development kit for single point range finding applications. The FDAcertified kit is based on the RBseries NIRenhanced SiPM from ON Semiconductor, and integrates all USER MANUAL essential system components including laser and reference circuit (Tx), receiving circuit (Rx), power management systems, and core FPGA and UART communication. The Silicon Photomultiplier (SiPM) is a singlephotosensitive, high performance, solidstate sensor. It is formed of a summed array of closelypacked Single Photon Avalanche Photodiode (SPAD) sensors with integrated quench resistors, resulting in a compact sensor that has high gain (~1x106), high detection efficiency (> 50%) and fast timing (subns rise times). Features Direct ToF Operation for a Single Point Figure 1. SECO RANGEFINDERGEVK > 0.11 m to 23 m Distance 6501050 nm BK7 Planoconvex Lenses to Maximize Distance Applications Measurement Indoor Navigation and Rangefinding Outofthe Box Operation with Dedicated GUI Collision Detection FDA Certified 3D Mapping Single Power Supply (either from USB = 5 V or PMOD Connector = 3.3 V) Collateral (See More Information on Page 54) FPGAbased TimetoDigital Convertor (TDC) SECORANGEFINDERGEVK Single Power Supply MICRORB10010MLP SiPM (either from USB = 5 V or PMOD Connector = 3.3 V) Photodiode (RB Series) Optimized System Cost NSVF4015SG4 RF Transistor Extendable System with the Bluetooth Development Kit NBA3N012C Discriminator (BDKGEVK) and Other Various Sensors and Actuators (RF Comparator) NCP81074A High Speed MOSFET Driver FQT13N06L Logic Level MOSFET for Laser Diode Figure 2. Block Diagram Semiconductor Components Industries, LLC, 2020 1 Publication Order Number: February, 2021 Rev. 3 UM70015/DSECORANGEFINDERGEVK Laser Notice IMPORTANT SAFETY AND EVALUATION BOARD INFORMATION This evaluation board meets the power requirements for a Class 1 Laser product to BS EN 608251:2014 under WARNING normal operating conditions and those of single fault failure. Complies with IEC / EN 608251:2014 and 21CFR 1040.10 Failure to heed the following warnings could result in an and 1040.11 except for deviations pursuant to Laser Notice accident resulting in death or serious injury. No.56, dated May 8th 2019. Labelling Laser Warning The following label is present on This device requires no regular maintenance. In the event SECORANGEFINDERGEVK aperture. Label shall be that the device becomes damaged or is inoperable, repair or legible, durable and permanently attached. service must be handled by authorized, factorytrained technicians only. Attempting to repair or service the unit on your own can result in direct exposure to laser radiation and the risk of permanent eye damage. For repair or service, contact your ON Semiconductor representative for more information. This device should not be modified or operated without its housing or optics. Operating this device without ahousing and optics, or operating this device with Laser Notice No. 56 a modified housing or optics that expose the laser source, may result in direct exposure to laser radiation and the risk The following label is present on of permanent eye damage. Removal or modification of the SECORANGEFINDERGEVK baseplate. Label shall be diffuser in front of the laser optic may result in the risk of legible, durable and permanently attached. permanent eye damage. CAUTION Failure to heed the following cautions could result in minor or moderate injury. Actual SECORANGEFINDER GEVK Board Labeling Laser Caution The following picture shows the actual placement of labels Caution Use of controls or adjustments or performance of on the SECORANGEFINDERGEVK. procedures other than those specified herein may result in hazardous radiation exposure. Any modifications to the product, including but not limited to change of electronic components, optics, or FPGA code may result in hazardous radiation exposure. This device emits laser radiation. This laser product is designated Class 1 during all procedures of operation. It is advisable to avoid looking into the beam when operating the device and to turn off the module when not in use. This device must be used only according to the directions and procedures described in the Operation Manual and Technical Specifications, available at www.onsemi.com. Use of controls or adjustments, or performance of procedures other than those specified herein, may result in hazardous radiation exposure. Scope and Purpose This user guide provides practical guidelines for using NOTICE dToF platform SECORANGEFINDER GEVK and Failure to heed the following notice could result in personal describes in details the overall functionality of the board. It or property damage, or negatively impact the device meets the power requirements for a Class 1 Laser product to functionality. BS EN 608251:2014 under normal operating conditions and those of single fault failure. The design complies with www.onsemi.com 2