PDTB123EQA Nexperia

PDTD113/123/143/114EQA series 50 V, 500 mA NPN resistor-equipped transistors Rev. 1 4 February 2016 Product data sheet 1. Product profile 1.1 General description NPN Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. Table 1. Product overview Type number R1 R2 Package NXP PNP complement PDTD113EQA 1 k 1k DFN1010D-3 PDTB113EQA (SOT1215) PDTD123EQA 2.2 k 2.2 k PDTB123EQA PDTD143EQA 4.7 k 4.7 k PDTB143EQA PDTD114EQA 10 k 10 k PDTB114EQA 1.2 Features and benefits 500 mA output current capability Reduced pick and place costs Built-in bias resistors Low package height of 0.37 mm 10% resistor ratio tolerance Suitable for Automatic Optical Inspection (AOI) of solder joint Simplifies circuit design AEC-Q101 qualified Reduces component count 1.3 Applications Digital applications Controlling IC inputs Cost saving alternative for Switching loads BC807/BC817 series in digital applications 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V collector-emitter voltage open base - - 50 V CEO I output current - - 500 mA O DFN1010D-3PDTD113/123/143/114EQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 2. Pinning information Table 3. Pinning Pin Symbol Description Simplified outline Graphic symbol 1 I input (base) O 2 GND GND (emitter) 1 R1 I 3 O output (collector) 4 3 4 O output (collector) R2 GND 2 aaa-019964 Transparent top view 3. Ordering information Table 4. Ordering information Type number Package Name Description Version PDTD113EQA DFN1010D-3 plastic thermal enhanced ultra thin small outline SOT1215 package no leads 3 terminals PDTD123EQA body: 1.1 1.0 0.37 mm PDTD143EQA PDTD114EQA PDTD113 123 143 114EQA SER All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. All rights reserved. Product data sheet Rev. 1 4 February 2016 2 of 23