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Chip Inductors for RF Applications (WChip Inductors for RF Applications (Wire wound-open)ire wound-open)
FASTRON wire wound chip inductors are designed particularly for RF applications that require optimal Q on high frequency circuits. Its gold flash pad metallization
provides better solderability for a higher yield in your production. In addition, their encapsulation not only protects the winding but also allows surface mount assembly.
It comes in compact sizes (from 0402 to 1812) available in reel packing. Inductance values between those listed in this catalog are mostly available on request. Ferrite
core versions are also available for selected case sizes for applications which require higher inductances in a smaller case size.
Used in LC resonant circuits such as oscillator and signal generators, impedance matching, RF filters etc.
Applications
Mobile Telecommunication: GSM, CDMA, TCDMA, cordless phones, 2 way radio
Automotive Subsystems: TPMS, Keyless Entry, Anti-Theft, GPS
Wireless Communication: W-LAN, WIFI, WIMAX, RFID, Bluetooth
Non-magnetic versions for medical imaging applications: ASM series
Technical Data
L Value (rated inductance) 1 MHz measured with HP 4286A RF LCR meter at frequency f
L
< 1 MHz measured with Bode 100 Vector Network Analyzer at frequency f
L
Q Factor (min) 1 MHz measured with HP 4287A RF LCR meter at frequency f
Q
< 1 MHz measured with Bode 100 Vector Network Analyzer at frequency fQ
SRF (min) Measured with HP 8753ES Network Analyzer
DCR (max) Measured at 25C
Operating Temperature For ceramic core from -40C to +150C (Including component self-heating)
For ferrite core from -40C to +85C
Surface Finishing Epoxy molded flat top for perfect pick and place assembly
Pad Metallization Gold flash as top layer for AS, AQ, F & AF
Silver flash as top layer for ASM
Wire Termination Spot welding
Recommended soldering method Reflow
Moisture Sensitivity Levels (MSL) MSL Level 1, indicating unlimited floor life at 30C / 85% relative humidity
Solderability Using lead free solder (Sn 99.9) at 260C 5C for 5 0.5 seconds, min 90% solder coverage
of metallization
Standard: IEC 68-2-20 (Ta)
Resistance to Soldering Heat Resistant to 260C 5C for 10 1 seconds
Standard: IEC 68-2-20 (Tb)
Resistance to Solvent Resistant to Isopropyl alcohol for 5 0.5 minutes at 23C 5C
Standard: IEC 68-2-45
Climatic Test Defined by the following standards
IEC 68-2-1 for Cold test: -55C for 96 hours
IEC 68-2-2 for Dry heat test: +85C for ferrite core and 125C for ceramic core for 96 hours
IEC 60068-2-78 for Humidity test: 40C at RH 95% for 4 days
Thermal Shock Test Temperature cycle (ceramic) : -40C to +125C to -40C
Temperature cycle (ferrite) : -40C to +85C to -40C
Max/Min temperature duration: 15 minutes
Temperature transition duration: 5 minutes
Cycles: 25
Standard: MIL-STD-202G
Adhesion of Soldered Component Components withstand a pushing force of 10N for 10 1 seconds
(Shear Test) Standard: IEC 60068-2-21, method Ue3
Mechanical Shock Mil-Std 202 Method 213, Condition C
3 axis, 6 times, total 18 shocks
100 G, 6 ms, half-sine
Vibration Mil-Std 202 Method 204
20 mins at 5G
10 Hz to 2000 Hz
12 cycles each of 3 orientations
Ordering Code Example: 0402AS-1N0X-YY
0402AS-1N0K-01
0402 AS - 1N0 X - YY
(Case Size) (Core Type) (Inductance Value) (Tolerance) (Packing Code)
Case Sizes - 0402, 0603, 0805, 1008, 1206, 1210, 1812
Core Type - AS, AQ, ASM (Ceramic), F (Ferrite), AF (Ceramic & Ferrite)
Tolerances - F (1%), G (2%), A (3%), J (5%), K (10%), M (20%)
Packing Code - 01, 04, 08 (Taped / Reel)
Revision date : 06 Sept 2016
Technical DataW
www.fastrongroup.com
Chip Inductors for RF Applications (WChip Inductors for RF Applications (Wire wound-open)ire wound-open)
D
B
d
K0 K0
D0
P1
P P0
Packing
Specification
d1
T
Fig.1 Fig.2
b
drawing only schematic, see table
Type Packing Code D D0 d d1 B b W P P0 P1 K0 T Fig
0402 01, 08 180 1.55 60 13 12.7 8.4 8 2 4 2 0.6 - 2
0603 01, 08 180 1.55 60 13 12.7 8.4 8 4 4 2 0.97 1.05 1
0603 04 330 1.55 100 13 14.4 8.4 8 4 4 2 0.97 1.05 1
0805 01, 08 180 1.55 60 13 12.7 8.4 8 4 4 2 1.63 0.25 1
0805 04 330 1.55 100 13 14.4 8.4 8 4 4 2 1.63 0.25 1
1008 01,08 180 1.50 60 13 12.7 8.4 8 4 4 2 2.23 0.3 1
1008 04 330 1.55 100 13 14.4 8.4 8 4 4 2 1.63 0.25 1
1206 01,08 180 1.50 60 13 18.4 13.7 12 4 4 2 1.8 0.3 1
1206 04 330 1.50 100 13 18.4 12.4 12 4 4 2 1.8 0.3 1
1210 01 180 1.55 60 13 18.4 13.7 12 8 4 2 2.55 0.3 1
1210 04 330 1.55 100 13 18.4 12.4 12 8 4 2 2.55 0.3 1
1812 01 180 1.50 60 13 18.4 13.7 12 8 4 2 3.70 0.35 1
1812 04 330 1.50 100 13 18.4 12.4 12 8 4 2 3.70 0.35 1
Revision date : 06 Sept 2016
All dimensions in mm
Packing Specification