REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate. Add QD certification. Change code ident. no. to 00-06-22 Raymond Monnin 67268. Editorial changes throughout. --les B Update to current requirements. Editorial changes throughout. - gap 06-01-05 Raymond Monnin CURRENT CAGE CODE 67268 The original first page of this drawing has been replaced. REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joe A. Kerby DEFENSE SUPPLY CENTER COLUMBUS CHECKED BY COLUMBUS, OHIO 43218-3990 STANDARD 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86834 01 C X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F243 Quad noninverting bus transceivers, with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (V ) ............................................................................ -0.5 V dc to +7.0 V dc CC DC input voltage range (V ) .......................................................................... -0.5 V dc to V +0.5 V dc IN CC Storage temperature range (T ) ................................................................. -65C to +150C STG Maximum power dissipation (P ) ................................................................... 495 mW 1/ D Lead temperature (soldering, 10 seconds) ..................................................... +300C Thermal resistance, junction-to-case ( ) ..................................................... See MIL-STD-1835 JC Junction temperature (T ) .............................................................................. +175C 2/ J 1.4 Recommended operating conditions. Supply voltage range (V ) .............................................................................. 4.5 V dc minimum to 5.5 V dc maximum CC Minimum high level input voltage (V ) ............................................................. 2.0 V dc IH Maximum low level input voltage (V ) ............................................................. 0.8 V dc IL Normalized fanout (each output): Low-level logic .............................................................................................. 33 maximum High-level logic ............................................................................................. 50 maximum Case operating temperature range (T ) ........................................................... -55C to +125C C 1/ Maximum power dissipation is defined as V x I , and must withstand the added P due to short circuit test e.g., I CC CC D OS. 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. SIZE STANDARD 5962-86834 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 B 2 DSCC FORM 2234 APR 97