ZXMD63N03X DUAL 30V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features I Low On-Resistance D V R Package (BR)DSS DS(ON) T = +25C Low Threshold A (Notes 5 & 6) Fast Switching Speed 135m V = 10V 2.3A GS Low Gate Drive 30V MSOP-8 200m V = 4.5V 1.9A Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) GS Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Description This MOSFET has been designed to minimize the on-state resistance Mechanical Data (R ) and yet maintain superior switching performance, making it DS(on) Case: MSOP-8 ideal for high efficiency power management applications. Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 Applications Moisture Sensitivity: Level 1 per J-STD-020 e3 Terminals: Matte Tin Finish DC-DC Converters Weight: 0.008 grams (approximate) Power Management Functions Motor Control Disconnect Switches MSOP8 Top View Device Symbol Pin-Out Top View Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXMD63N03XTA ZXM63N03 7 12 1,000 ZXMD63N03XTC ZXM63N03 13 12 4,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMD63N03X Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 30 V DSS Gate-Source Voltage V 20 V GSS V = 4.5V T = +25C (Note 5 & 6) Steady GS A 2.3 Continuous Drain Current I A D State 1.8 V = 4.5V T = +70C (Note 5 & 6) GS A Pulsed Drain Current (Notes 6 & 7) 14 A I DM Continuous Source Current (Body Diode) (Notes 5 & 6) 1.5 A I S Pulsed Source Current (Body Diode) (Notes 6 & 7) I 14 A SM Thermal Characteristics Characteristic Symbol Value Unit (Notes 6 & 8) 0.87 Power Dissipation (Notes 5 & 6) P 1.25 W D (Notes 8 & 9) 1.04 (Notes 6 & 8) 143 Thermal Resistance, Junction to Ambient (Notes 5 & 6) R 100 C/W JA (Notes 8 & 9) 120 Thermal Resistance, Junction to Leads (Note 10) R 84.9 C/W JL Operating and Storage Temperature Range T , T -55 to +150 C J STG Notes: 5. For a device surface mounted on FR4 PCB measured at t 10 sec. 6. For device with one active die. 7. Repetitive rating - 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300s pulse width limited by maximum junction temperature. 8. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. 9. For device with two active die running at equal power. 10. Thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 8 March 2014 ZXMD63N03X Diodes Incorporated www.diodes.com Document number: DS33501 Rev. 2 - 2