NOT RECOMMENDED FOR NEW DESIGN USE ABS10A MSB10M Green 1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER Product Summary ( T = +25C) Features and Benefits A Glass Passivated Die Construction V (V) I (A) V (V) I (A) RRM O F R Compact, Thin Profile Package Design 1,000 1.0 1.05 5 Reliable Robust Construction Ideal for SMT Manufacturing Lead Free Finish RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), Description and Applications please contact us or your local Diodes representative. Suitable for AC to DC bridge full-wave rectification for SMPS, LED NOT RECOMMENDED FOR NEW DESIGN USE ABS10A MSB10M Maximum Ratings ( T = +25C, unless otherwise specified.) A Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol Value Unit V Peak Repetitive Reverse Voltage RRM Working Peak Reverse Voltage 1,000 V RWM V DC Blocking Voltage V R RMS Reverse Voltage V 700 V R(RMS) Average Rectified Output Current T = +120C I 1.0 A C O Non-Repetitive Peak Forward Surge Current, 8.3ms I 35 A FSM Single Half Sine-Wave Superimposed on Rated Load Thermal Characteristics Characteristic Symbol Value Unit Typical Thermal Resistance, Junction to Ambient (Note 5) R 80 C/W JA Typical Thermal Resistance, Junction to Case R 12 C/W JC Typical Thermal Resistance, Junction to Lead R 40 C/W JL Operating and Storage Temperature Range T T -55 to +150 C J, STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Condition 1,000 Reverse Breakdown Voltage (Note 6) V V I = 5A (BR)R R 0.90 1.02 I = 0.5A F Forward Voltage V V F 0.96 1.05 I = 1A F 5 V = 1,000V, T = +25C R A Leakage Current (Note 6) I A R 500 V = 1,000V, T = +125C R A 10 Total Capacitance C pF V = 4V, f = 1.0MHz T R Notes: 5. Device mounted on glass-epoxy substrate with 1 oz 20mm x 20mm Cu pad per pin. 6. Short duration pulse test used to minimize self-heating effect. 2 of 5 MSB10M October 2019 Diodes Incorporated www.diodes.com Document number: DS37032 Rev. 4 - 3 ADVANCED INFORMATION