Document Number: IMX8MMIEC
NXP Semiconductors
Rev. 0.2, 04/2019
Data Sheet: Technical Data
MIMX8MM6CVTKZAA MIMX8MM5CVTKZAA
MIMX8MM4CVTKZAA MIMX8MM3CVTKZAA
MIMX8MM2CVTKZAA MIMX8MM1CVTKZAA
i.MX 8M Mini Applications
Processor Datasheet for
Industrial Products
Package Information
Plastic Package
FCBGA 14 x 14 mm, 0.5 mm pitch
Ordering Information
See Table 2 on page 6
1 i.MX 8M Mini introduction
The i.MX 8M Mini applications processor represents 1. i.MX 8M Mini introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
NXPs latest video and audio experience combining
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
state-of-the-art media-specific features with
2. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1. Recommended connections for unused input/output 12
high-performance processing while optimized for lowest
3. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
power consumption.
3.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 14
3.2. Power supplies requirements and restrictions . . . 22
The i.MX 8M Mini family of processors features
3.3. PLL electrical characteristics . . . . . . . . . . . . . . . . 26
advanced implementation of a quad Arm Cor-
3.4. On-chip oscillators . . . . . . . . . . . . . . . . . . . . . . . . 27
3.5. General purpose I/O (GPIO) DC parameters . . . 28
tex -A53 core, which operates at speeds of up to
3.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . 29
1.6 GHz. A general purpose Cortex -M4 400 MHz
3.7. Output buffer impedance parameters . . . . . . . . . 30
3.8. System modules timing . . . . . . . . . . . . . . . . . . . . 32
core processor is for low-power processing. The DRAM
3.9. External peripheral interface parameters . . . . . . 33
controller supports 32-bit/16-bit LPDDR4, DDR4, and
4. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 68
4.1. Boot mode configuration pins . . . . . . . . . . . . . . . 68
DDR3L memory. A wide range of audio interfaces are
4.2. Boot device interface allocation . . . . . . . . . . . . . . 69
available, including I2S, AC97, TDM, and S/PDIF.
5. Package information and contact assignments . . . . . . . 70
There are a number of other interfaces for connecting
5.1. 14 x 14 mm package information . . . . . . . . . . . . 70
5.2. DDR pin function list . . . . . . . . . . . . . . . . . . . . . . 87
peripherals, such as USB, PCIe, and Ethernet.
6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
NXP reserves the right to change the production detail specifications as may be required
to permit improvements in the design of its products.i.MX 8M Mini introduction
Table 1. Features
Subsystem Features
Arm Cortex-A53 MPCore platform Quad symmetric Cortex-A53 processors
32 KB L1 Instruction Cache
32 KB L1 Data Cache
Media Processing Engine (MPE) with NEON technology supporting the Advanced
Single Instruction Multiple Data architecture:
Floating Point Unit (FPU) with support of the VFPv4-D16 architecture
Support of 64-bit Armv8-A architecture
512 KB unified L2 cache
Arm Cortex-M4 core platform Low power microcontroller available for customer application:
low power standby mode
IoT features including Weave
Manage IR or Wireless Remote
Cortex M4 CPU:
16 KB L1 Instruction Cache
16 KB L1 Data Cache
256 KB tightly coupled memory (TCM)
Connectivity One PCI Express (PCIe)
Single lane supporting PCIe Gen2
Dual mode operation to function as root complex or endpoint
Integrated PHY interface
Support L1 low power sub-state
Two USB 2.0 OTG controllers with integrated PHY interfaces:
Spread spectrum clock support
Three Ultra Secure Digital Host Controller (uSDHC) interfaces:
MMC 5.1 compliance with HS400 DDR signaling to support up to 400 MB/sec
SD/SDIO 3.0 compliance with 200 MHz SDR signaling to support up to 100
MB/sec
Support for SDXC (extended capacity)
One Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE),
Ethernet AVB, and IEEE 1588
Four Universal Asynchronous Receiver/Transmitter (UART) modules
2
Four I C modules
Three ECSPI modules
On-chip memory Boot ROM (256 KB)
On-chip RAM (256 KB + 32 KB)
GPIO and pin multiplexing General-purpose input/output (GPIO) modules with interrupt capability
Input/output multiplexing controller (IOMUXC) to provide centralized pad control
Power management Temperature sensor with programmable trip points
Flexible power domain partitioning with internal power switches to support efficient
power management
i.MX 8M Mini Applications Processor Datasheet for Industrial Products, Rev. 0.2, 04/2019
2 NXP Semiconductors