MAX71071/MAX71071H Dual-Channel Isolated Metrology ADCs General Description Benefits and Features The MAX71071/MAX71071H are dual-channel iso- Accurately Measure Voltage and Current lated analog-to-digital converters (ADCs) for use with Dual 24-Bit ADC a compatible MAX71xxx host. The device provides 0.1% Accuracy Over 2000:1 Dynamic Range current and voltage measurements to the host while Exceeds IEC 62053/ANSI C12.20 Standards the host provides control, command, and power to the On-Chip Temperature Sensor Enables Localized MAX71071/MAX71071H. A pulse transformer provides Digital Temperature Compensation the isolated data, clock, and power path between the Galvanic Isolation Through Pulse Transformer device and host, eliminating the need for additional Provides Power, Bidirectional Data, and Timing isolation components in the measurement subsystem. Reference These metrology ADCs operate over the industrial tem- 1.4mA Typical Consumption perature range and come in a 10-pin MAX package. On-Chip PLL and Power Monitoring MAX is a registered trademark of Maxim Integrated Products, Inc. Ordering Information appears at end of data sheet. Block Diagram MAX71071/MAX71071H REFERENCE TEMP SENSOR INVP P R E ADC FIR PLL A M INVN P HOST MICROCONTROLLER (MAX71xxx) INIP P R ISO E ADC FIR A I/F M ININ P 19-7302 Rev 1 1/15MAX71071/MAX71071H Dual-Channel Isolated Metrology ADCs Absolute Maximum Ratings (All voltages with respect to V .) Digital Pins SSA Supplies and Ground Pins TEST ....................................-10mA to +10mA, -0.5V to +3.6V V ...................................................................-0.5V to +3.6V Operating Junction Temperature (peak, 100ms) .............+140C CC V ...................................................................-0.1V to +0.1V Operating Junction Temperature (continuous) ................+125C SS Analog Input Pins Storage Temperature ........................................ -45C to +165C INP, INN, SP, SN .....-10mA to +10mA, -0.5V to (V + 0.5V) Solder Temperature (10s duration) .................................+250C CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) MAX Junction-to-Ambient Thermal Resistance ( ) Junction-to-Case Thermal Resistance ( )................42C/W JA JC Multilayer Board ................................................113.10C/W Single-Layer Board ..................................................180C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Recommended External Components NAME FROM TO FUNCTION VALUE UNITS C1 V V Bypass capacitor for supply 1.0 F CC SS To establish proper bias for INVN/INVP and R1, R2, R3, R4 Sensor GND 1.0 k ININ/INIP pins INVN 1k INVP 1k ININ 1k INIP MAX71071/MAX71071H 1k V SS 1F V CC Figure 1. Recommended External Components Circuit Maxim Integrated 2 www.maximintegrated.com