MAX5700/MAX5701/ Ultra-Small, Dual-Channel, 8-/10-/12-Bit Buffered MAX5702 Output DACs with Internal Reference and SPI Interface General Description Benefits and Features The MAX5700/MAX5701/MAX5702 2-channel, low-power, Two High-Accuracy DAC Channels 8-/10-/12-bit, voltage-output digital-to-analog converters 12-Bit Accuracy Without Adjustment (DACs) include output buffers and an internal reference 1 LSB INL Buffered Voltage Output that is selectable to be 2.048V, 2.500V, or 4.096V. The Monotonic Over All Operating Conditions MAX5700/MAX5701/MAX5702 accept a wide supply Independent Mode Settings for Each DAC voltage range of 2.7V to 5.5V with extremely low power Three Precision Selectable Internal References (1.5mW) consumption to accommodate most low-voltage 2.048V, 2.500V, or 4.096V applications. A precision external reference input allows Internal Output Buffer rail-to-rail operation and presents a 100kI (typ) load to Rail-to-Rail Operation with External Reference an external reference. 4.5s Settling Time The MAX5700/MAX5701/MAX5702 have an a 50MHz Outputs Directly Drive 2k Loads 3-wire SPI/QSPI/MICROWIRE/DSP-compatible serial Small 5mm x 3mm 10-Pin MAX or Ultra-Small interface. The DAC output is buffered and has a low sup- 3mm x 3mm 10-Pin TDFN Package ply current of less than 250FA per channel and a low Wide 2.7V to 5.5V Supply Range offset error of Q0.5mV (typ). On power-up, the MAX5700/ MAX5701/MAX5702 reset the DAC outputs to zero, pro- Separate 1.8V to 5.5V V Power-Supply Input DDIO viding additional safety for applications that drive valves 50MHz 3-Wire SPI/QSPI/MICROWIRE/DSP or other transducers which need to be off on power-up. Compatible Serial Interface The internal reference is initially powered down to allow Power-On-Reset to Zero-Scale DAC Output use of an external reference. The MAX5700/MAX5701/ MAX5702 allow simultaneous output updates using soft- CLR For Asynchronous Control ware LOAD commands. Three Software-Selectable Power-Down Output A clear logic input (CLR) allows the contents of the CODE Impedances and the DAC registers to be cleared asynchronously and 1k , 100k, or High Impedance sets the DAC outputs to zero. The MAX5700/MAX5701/ Low 350A Supply Current at 3V V DD MAX5702 are available in a 10-pin MAXM and an ultra- small, 10-pin TDFN package and are specified over the -40NC to +125NC temperature range. Functional Diagram Applications Programmable Voltage and Current Sources VDDIO VDD REF MAX5700 Gain and Offset Adjustment MAX5701 INTERNAL REFERENCE/ EXTERNAL BUFFER MAX5702 Automatic Tuning and Optical Control CSB 1 OF 2 DAC CHANNELS SCLK Power Amplifier Control and Biasing CODE DAC 8-/10-/12-BIT REGISTER LATCH DAC DIN OUTA Process Control and Servo Loops BUFFER SPI SERIAL CLR INTERFACE OUTB Portable Instrumentation CLEAR/ CLEAR/ Data Acquisition CODE RESET LOAD RESET 100kI 1kI DAC CONTROL LOGIC POWER-DOWN Ordering Information appears at end of data sheet. POR QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National GND Semiconductor Corporation. MAX is a registered trademark of Maxim Integrated Products, Inc. 19-6455 Rev 2 8/13MAX5700/MAX5701/ Ultra-Small, Dual-Channel, 8-/10-/12-Bit Buffered MAX5702 Output DACs with Internal Reference and SPI Interface Absolute Maximum Ratings V V to GND ................................................ -0.3V to +6V Maximum Continuous Current into Any Pin ....................Q50mA DD, DDIO OUT , REF to GND....-0.3V to the lower of (V + 0.3V) and +6V Operating Temperature Range ........................ -40NC to +125NC DD Storage Temperature Range ............................ -65NC to +150NC CSB, SCLK, CLR to GND ........................................ -0.3V to +6V DIN to GND .................................................-0.3V to the lower of Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) .................................... +260NC (V + 0.3V) and +6V DDIO Continuous Power Dissipation (T = +70NC) A MAX (derate at 8.8mW/NC above 70NC) ....................707mW TDFN (derate at 24.4mW/NC above 70NC) ................1951mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) MAX TDFN Junction-to-Ambient Thermal Resistance ( ) ........113NC/W Junction-to-Ambient Thermal Resistance ( ) ..........41NC/W JA JA Junction-to-Case Thermal Resistance ( ) ...............42NC/W Junction-to-Case Thermal Resistance ( ) .................9NC/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 2.7V to 5.5V, V = 1.8V to 5.5V, V = 0V, C = 200pF, R = 2kI, T = -40NC to +125NC, unless otherwise noted. Typical DD DDIO GND L L A values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC PERFORMANCE (Note 3) MAX5700 8 Resolution and Monotonicity N MAX5701 10 Bits MAX5702 12 MAX5700 -0.25 Q0.05 +0.25 Integral Nonlinearity (Note 4) INL MAX5701 -0.5 Q0.25 +0.5 LSB MAX5702 -1 Q0. 5 +1 MAX5700 -0.25 Q0.05 +0.25 Differential Nonlinearity (Note 4) DNL MAX5701 -0.5 Q0.1 +0.5 LSB MAX5702 -1 Q0.2 +1 Offset Error (Note 5) OE -5 Q0.5 +5 mV Offset Error Drift Q10 FV/NC Gain Error (Note 5) GE -1.0 Q0.1 +1.0 %FS ppm of Gain Temperature Coefficient With respect to V Q3.0 REF FS/NC Zero-Scale Error 0 10 mV Full-Scale Error With respect to V -0.5 +0.5 %FS REF Maxim Integrated 2 www.maximintegrated.com