MAX11638/MAX11639/MAX11642/MAX11643 19-6035 Rev 0 9/11 8-Bit, 16-/8-Channel, 300ksps ADCs with FIFO and Internal Reference General Description Features The MAX11638/MAX11639/MAX11642/MAX11643 are Analog Multiplexer with Track-and-Hold (T/H) serial 8-bit analog-to-digital converters (ADCs) with an 16 Channels (MAX11642/MAX11643) internal reference. These devices feature on-chip FIFO, 8 Channels (MAX11638/MAX11639) scan mode, internal clock mode, internal averaging, Single Supply and AutoShutdown. The maximum sampling rate is 2.7V to 3.6V (MAX11639/MAX11643) 300ksps using an external clock. The MAX11642/ 4.75V to 5.25V (MAX11638/MAX11642) MAX11643 have 16 input channels and the MAX11638/ MAX11639 have 8 input channels. These four devices Internal Reference operate from either a +3V supply or a +5V supply, and 2.5V (MAX11639/MAX11643) contain a 10MHz SPI-/QSPI-/MICROWIRE -compati- 4.096V (MAX11638/MAX11642) ble serial port. External Reference: 1V to V DD The MAX11638/MAX11639 are available in 16-pin 16-Entry First-In/First-Out (FIFO) QSOP packages. The MAX11642/MAX11643 are avail- Scan Mode, Internal Averaging, and Internal Clock able in 24-pin QSOP packages. All four devices are specified over the extended -40C to +85C tempera- Accuracy: 1 LSB INL, 1 LSB DNL, No Missing ture range. Codes Over Temperature 10MHz 3-Wire SPI-/QSPI-/MICROWIRE-Compatible Applications Interface System Supervision Small Packages Data-Acquisition Systems 16-Pin QSOP (MAX11638/MAX11639) Industrial Control Systems 24-Pin QSOP (MAX11642/MAX11643) Patient Monitoring Data Logging Pin Configurations Instrumentation TOP VIEW + Ordering Information AIN0 1 16 EOC AIN1 2 15 DOUT NUMBER SUPPLY PIN OF VOLTAGE AIN2 3 14 DIN PART PACKAGE INPUTS RANGE (V) AIN3 4 MAX11638 13 SCLK MAX11639 MAX11638EEE+T 8 4.75 to 5.25 16 QSOP AIN4 5 12 CS MAX11639EEE+T 8 2.7 to 3.6 16 QSOP AIN5 6 11 V DD MAX11642EEG+T 16 4.75 to 5.25 24 QSOP AIN6 7 10 GND MAX11643EEG+T 16 2.7 to 3.6 24 QSOP CNVST/AIN7 8 9 REF Note: All devices are specified over the -40C to +85C operating temperature range. QSOP +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. Pin Configurations continued at end of data sheet. AutoShutdown is a trademark of Maxim Integrated Products, Inc. QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National Semiconductor Corp. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE8-Bit, 16-/8-Channel, 300ksps ADCs with FIFO and Internal Reference ABSOLUTE MAXIMUM RATINGS V to GND..............................................................-0.3V to +6V Operating Temperature Range ...........................-40C to +85C DD CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (V + 0.3V) Storage Temperature Range .............................-60C to +150C DD AIN0AIN13, CNVST/AIN , Junction Temperature......................................................+150C + 0.3V) REF to GND...........................................-0.3V to (V Lead Temperature (soldering, 10s) .................................+300C DD Maximum Current into Any Pin............................................50mA Soldering Temperature (reflow) .......................................+260C Continuous Power Dissipation (T = +70C) A 16-Pin QSOP (derate 8.3mW/C above +70C)...........667mW 24-Pin QSOP (derate 9.5mW/C above +70C)...........762mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) 16 QSOP 24 QSOP Junction-to-Ambient Thermal Resistance ( )...............105C/W Junction-to-Ambient Thermal Resistance ( )................88C/W JA JA Junction-to-Case Thermal Resistance ( )......................37C/W Junction-to-Case Thermal Resistance ( ).......................34C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = +2.7V to +3.6V (MAX11639/MAX11643), V = +4.75V to +5.25V (MAX11638/MAX11642), f = 300kHz, f = DD SAMPLE SCLK DD 4.8MHz (external clock 50% duty cycle), V = 2.5V (MAX11639/MAX11643), V = 4.096V (MAX11638/MAX11642), T = T to REF REF A MIN T , unless otherwise noted. Typical values are at T = +25C.) (Note 2) MAX A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Note 3) Resolution RES 8 Bits Integral Nonlinearity INL 0.5 LSB Differential Nonlinearity DNL No missing codes over temperature 0.5 LSB Offset Error 0.5 1 LSB Gain Error (Note 4) 0.5 1 LSB Offset Error Temperature ppm/C 2 Coefficient FSR Gain Temperature Coefficient 0.8 ppm/C Channel-to-Channel Offset 0.1 LSB Matching DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, f = 4.8MHz) SCLK Signal-to-Noise Plus Distortion SINAD 49 dB Total Harmonic Distortion THD Up to the 5th harmonic -70 dBc Spurious-Free Dynamic Range SFDR -72 dBc Intermodulation Distortion IMD f = 29.9kHz, f = 30.1kHz -67 dBc IN1 IN2 Full-Power Bandwidth -3dB point 1 MHz Full-Linear Bandwidth S/(N + D) > 48dB 100 kHz 2 MAX11638/MAX11639/MAX11642/MAX11643