MAX11618MAX11621/MAX11624/MAX11625 19-5961 Rev 1 9/11 10-Bit, 300ksps ADCs with FIFO and Internal Reference General Description Features The MAX11618MAX11621/MAX11624/MAX11625 are Analog Multiplexer with Track/Hold serial 10-bit analog-to-digital converters (ADCs) with an 16 Channels (MAX11624/MAX11625) internal reference. These devices feature on-chip FIFO, 8 Channels (MAX11620/MAX11621) scan mode, internal clock mode, internal averaging, 4 Channels (MAX11618/MAX11619) and AutoShutdown. The maximum sampling rate is 300ksps using an external clock. The MAX11624/ Single Supply MAX11625 have 16 input channels, the MAX11620/ 2.7V to 3.6V (MAX11619/MAX11621/MAX11625) MAX11621 have 8 input channels, and the MAX11618/ 4.75V to 5.25V MAX11619 have 4 input channels. These six devices (MAX11618/MAX11620/MAX11624) operate from either a +3V supply or a +5V supply, and Internal Reference contain a 10MHz SPI-/QSPI-/MICROWIRE-com- patible serial port. 2.5V (MAX11619/MAX11621/MAX11625) 4.096V (MAX11618/MAX11620/MAX11624) The MAX11618MAX11621 are available in 16-pin QSOP packages. The MAX11624/MAX11625 are avail- External Reference: 1V to V DD able in 24-pin QSOP packages. All six devices are 16-Entry First-In/First-Out (FIFO) specified over the extended -40C to +85C tempera- Scan Mode, Internal Averaging, and Internal Clock ture range. Accuracy: 1 LSB INL, 1 LSB DNL, No Missing Applications Codes Over Temperature 10MHz 3-Wire SPI-/QSPI-/MICROWIRE-Compatible System Supervision Interface Data-Acquisition Systems Small Packages Industrial Control Systems 16-Pin QSOP (MAX11618MAX11621) 24-Pin QSOP (MAX11624/MAX11625) Patient Monitoring Data Logging Ordering Information Instrumentation NUMBER SUPPLY PIN- PART OF VOLTAGE PACKAGE INPUTS RANGE (V) MAX11618EEE+T 4 4.75 to 5.25 16 QSOP MAX11619EEE+T 4 2.7 to 3.6 16 QSOP MAX11620EEE+T 8 4.75 to 5.25 16 QSOP MAX11621EEE+T 8 2.7 to 3.6 16 QSOP MAX11624EEG+T 16 4.75 to 5.25 24 QSOP MAX11625EEG+T 16 2.7 to 3.6 24 QSOP Note: All devices are specified over the -40C to +85C operating temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. AutoShutdown is a trademark of Maxim Integrated Products, Inc. SPI/QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.10-Bit, 300ksps ADCs with FIFO and Internal Reference ABSOLUTE MAXIMUM RATINGS V to GND..............................................................-0.3V to +6V Operating Temperature Range ...........................-40C to +85C DD CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (V + 0.3V) Storage Temperature Range .............................-60C to +150C DD AIN0AIN14, CNVST/AIN , Junction Temperature......................................................+150C REF to GND...........................................-0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C DD Maximum Current into Any Pin............................................50mA Soldering Temperature (reflow) .......................................+260C Continuous Power Dissipation (T = +70C) A 16-Pin QSOP (derate 8.3mW/C above +70C)...........667mW 24-Pin QSOP (derate 9.5mW/C above +70C)...........762mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) 16 QSOP 24 QSOP Junction-to-Ambient Thermal Resistance ( )...............105C/W Junction-to-Ambient Thermal Resistance ( )................88C/W JA JA Junction-to-Case Thermal Resistance ( )......................37C/W Junction-to-Case Thermal Resistance ( ).......................34C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = 2.7V to 3.6V (MAX11619/MAX11621/MAX11625) V = 4.75V to 5.25V (MAX11618/MAX11620/MAX11624), DD DD f = 300kHz, f = 4.8MHz (external clock, 50% duty cycle), V = 2.5V (MAX11619//MAX11621/MAX11625) V = 4.096V SAMPLE SCLK REF REF (MAX11618/MAX11620/MAX11624), T = T to T , unless otherwise noted. Typical values are at T = +25C.) (Note 2) A MIN MAX A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Note 3) Resolution RES 10 Bits Integral Nonlinearity INL 1.0 LSB Differential Nonlinearity DNL No missing codes over temperature 1.0 LSB Offset Error 0.5 2.0 LSB Gain Error (Note 4) 0.5 2.0 LSB Offset Error Temperature ppm/C 2 Coefficient FSR Gain Temperature Coefficient 0.8 ppm/C Channel-to-Channel Offset 0.1 LSB Matching DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 300ksps, f = 4.8MHz) SCLK Signal-to-Noise Plus Distortion SINAD 62 dB Total Harmonic Distortion THD Up to the 5th harmonic -79 dBc Spurious-Free Dynamic Range SFDR -81 dBc Intermodulation Distortion IMD f = 29.9kHz, f = 30.1kHz -74 dBc IN1 IN2 Full-Power Bandwidth -3dB point 1 MHz Full-Linear Bandwidth S/(N + D) > 61dB 100 kHz 2 MAX11618MAX11621/MAX11624/MAX11625