EVALUATION KIT AVAILABLE MAX11321MAX11328 1Msps, 10-/12-Bit, 4-/8-/16-Channel ADCs with Post-Mux External Signal Conditioning Access General Description Benefits and Features The MAX11321MAX11328 are 12-/10-bit with external S Highly Integrated Precision ADC Saves Space reference and 500kHz, full-linear-bandwidth, high-speed, While Retaining Flexibility low-power, serial-output successive approximation reg- 1 LSB INL, 1 LSB DNL, No Missing Codes ister (SAR) analog-to-digital converters (ADCs). The 70dB SINAD at 100kHz MAX11321MAX11328 provide external access to the 1Msps Conversion Rate with No Pipeline Delay output of the integrated mux and ADC input, to simplify S Analog Multiplexer with True Differential Track/Hold: conditioning. The MAX11321MAX11328 include both Any Combination of Single-Ended, Differential and internal and external clock modes. These devices feature Pseudo-Differential Input Pin Pairs Allowed scan mode in both internal and external clock modes. The 16-/8-/4-Channel Single-Ended internal clock mode features internal averaging to increase 12-/8-/4-Channel Fully-Differential Pairs SNR. The external clock mode features the SampleSetK 15-/8-/4-Channel Pseudo-Differential Relative to technology, a user-programmable analog input channel a Common Input sequencer. The SampleSet approach provides greater sequencing flexibility for multichannel applications while S Two Software-Selectable Bipolar Input Ranges: alleviating significant microcontroller or DSP (controlling V +/2, V + REF REF unit) communication overhead. S External Differential Reference (1V to V ) DD External pins provide access to the output of the S 32-Pin, 5mm x 5mm TQFN Package multiplexer and ADC inputs to simplify multichannel sig- S SampleSet Technology Brings Extreme nal conditioning. The internal clock mode features an inte- Flexibility to Program Input Configurations Per grated FIFO allowing data to be sampled at high speeds Channel and Sampling Sequence to Optimize and then held for readout at any time or at a lower clock Interface to the Microcontroller rate. Internal averaging is also supported in internal clock User-Defined Channel Sequence with Maximum mode improving SNR for noisy input signals. The devices feature analog input channels that can be configured to Length of 256 be single-ended inputs, fully differential pairs, or pseudo- Scan Modes, Internal Averaging, and Internal Clock differential inputs with respect to one common input. The 16-Entry First-In/First-Out (FIFO) MAX11321MAX11328 operate from a 2.35V to 3.6V sup- S Post-Mux Signal Access Allows for External ply and consume only 5.4mW at 1Msps. Signal Conditioning Between the Mux and the The MAX11321MAX11328 include AutoShutdownK, ADC Even for Differential Signals fast wake-up, and a high-speed 3-wire serial interface. Externally Accessible Multiplex Output and ADC Input The devices feature full power-down mode for optimal S Low-Power Consumption Extends Battery Life for power management. The 48MHz, 3-wire serial interface Portable Applications M directly connects to SPI, QSPIK, and MICROWIRE 1.5V to 3.6V Digital I/O Supply Voltage devices without external logic. 2.35V to 3.6V Supply Voltage Excellent dynamic performance, low voltage, low power, 5.4mW at 1Msps with 3V Supplies ease of use, and small package size make these convert- 2A Full-Shutdown Current ers ideal for portable battery-powered data-acquisition S Easy to Interface with Most Microcontrollers applications, and for other applications that demand low 16MHz, 3-Wire SPI-/QSPI-/MICROWIRE-/DSP- power consumption and small space. Compatible Serial Interface The MAX11321MAX11328 are available in 32-pin, 5mm x 5mm, TQFN packages and operate over the -40NC to Applications +125NC temperature range. High-Speed Data Medical Instrumentation Acquisition Systems SampleSet and AutoShutdown are trademarks of Maxim Battery-Powered Integrated Products, Inc. High-Speed Closed-Loop Instruments QSPI is a trademark of Motorola, Inc. Systems MICROWIRE is a registered trademark of National Semiconductor Portable Systems Corp. Industrial Control Systems Ordering Information appears at end of data sheet. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-6467 Rev 1 12/14MAX11321MAX11328 1Msps, 10-/12-Bit, 4-/8-/16-Channel ADCs with Post-Mux External Signal Conditioning Access ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +4V Continuous Power Dissipation (T = +70NC) DD A AOP, AON, AIP, AIN, OVDD, AIN0AIN13, CNVST/AIN14, REF+, TQFN (derate 34.4mW/NC above +70NC)..................2758mW REF-/AIN15 to GND ....................................... -0.3V to the lower of Operating Temperature Range ........................ -40NC to +125NC Junction Temperature .....................................................+150NC (V + 0.3V) and +4V DD CS, SCLK, DIN, DOUT, EOC TO GND .......-0.3V to the lower of Storage Temperature Range ............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC (V + 0.3V) and +4V OVDD Soldering Temperature (reflow) ......................................+260NC DGND to GND ......................................................-0.3V to +0.3V Input/Output Current (all pins) ...........................................50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN Junction-to-Ambient Thermal Resistance (B ) ...........29NC/W JA Junction-to-Case Thermal Resistance (B ) ...............1.7NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (MAX11322/MAX11325/MAX11328) (V = 2.35V to 3.6V, V = 1.5V to 3.6V, f = 1Msps, f = 16MHz, 50% duty cycle, V = V , T = -40NC to +125NC, DD OVDD SAMPLE SCLK REF+ DD A unless otherwise noted. Typical values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Notes 3 and 4) Resolution RES 12 bit 12 Bits Integral Nonlinearity INL Q1.0 LSB Differential Nonlinearity DNL No missing codes Q1.0 LSB Offset Error 1.2 Q3.0 LSB Gain Error (Note 5) 0.02 Q5.5 LSB Offset Error Temperature Coefficient OE Q2 ppm/NC TC Gain Temperature Coefficient GE Q0.8 ppm/NC TC Channel-to-Channel Offset Matching Q0.5 LSB Line Rejection PSR (Note 6) 0.3 Q2 LSB/V DYNAMIC PERFORMANCE (100kHz, Input Sine Wave) (Notes 3 and 7) Signal-to-Noise Plus Distortion SINAD 70 71.9 dB Signal-to-Noise Ratio SNR 70 72.3 dB Total Harmonic Distortion THD -83 -76 dB (Up to the 5th Harmonic) Spurious-Free Dynamic Range SFDR 77 84 dB Intermodulation Distortion IMD f = 99.2432kHz, f = 69.2139kHz -85 dB 1 2 -3dB 30 Full-Power Bandwidth MHz -0.1dB 5 Full-Linear Bandwidth SINAD 70dB 0.5 MHz Maxim Integrated 2