EVALUATION KIT AVAILABLE MAX11129MAX11132 3Msps, Low-Power, Serial 12-/10-Bit, 8-/16-Channel ADCs General Description Benefits and Features S Scan Modes, Internal Averaging, and Internal The MAX11129MAX11132 are 12-/10-bit with external Clock reference and industry-leading 1.5MHz, full linear band- S 16-Entry First-In/First-Out (FIFO) width, high speed, low-power, serial output successive approximation register (SAR) analog-to-digital convert- S SampleSet: User-Defined Channel Sequence with Maximum Length of 256 ers (ADCs). The MAX11129MAX11132 include both S Analog Multiplexer with True Differential internal and external clock modes. These devices feature Track/Hold scan mode in both internal and external clock modes. 16-/8-Channel Single-Ended The internal clock mode features internal averaging to 8-/4-Channel Fully-Differential Pairs increase SNR. The external clock mode features the 15-/8-Channel Pseudo-Differential Relative to SampleSetK technology, a user-programmable analog a Common Input input channel sequencer. The SampleSet approach S Two Software-Selectable Bipolar Input Ranges provides greater sequencing flexibility for multichannel QV /2, QV REF+ REF+ applications while alleviating significant microcontroller S Flexible Input Configuration Across All Channels or DSP (controlling unit) communication overhead. S High Accuracy Q1 LSB INL, Q1 LSB DNL, No Missing Codes The internal clock mode features an integrated FIFO Over Temperature Range allowing data to be sampled at high speeds and then held S 70dB SINAD Guaranteed at 500kHz Input for readout at any time or at a lower clock rate. Internal Frequency averaging is also supported in this mode improving SNR S 1.5V to 3.6V Wide Range I/O Supply for noisy input signals. The devices feature analog input Allows the Serial Interface to Connect Directly channels that can be configured to be single-ended to 1.8V, 2.5V, or 3.3V Digital Systems inputs, fully differential pairs, or pseudo-differential inputs S 2.35V to 3.6V Supply Voltage with respect to one common input. The MAX11129 S Longer Battery Life for Portable Applications MAX11132 operate from a 2.35V to 3.6V supply and con- Low Power sume only 15.2mW at 3Msps. 15.2mW at 3Msps with 3V Supplies 2A Full-Shutdown Current The MAX11129MAX11132 include AutoShutdownK, S External Differential Reference (1V to V ) fast wake-up, and a high-speed 3-wire serial interface. DD The devices feature full power-down mode for optimal S 48MHz, 3-Wire SPI-/QSPI-/MICROWIRE-/DSP- Compatible Serial Interface power management. S Wide -40NC to +125NC Operation The 48MHz, 3-wire serial interface directly connects to M S Space-Saving, 28-Pin, 5mm x 5mm TQFN SPI, QSPIK, and MICROWIRE devices without external Packages logic. S 3Msps Conversion Rate, No Pipeline Delay Excellent dynamic performance, low voltage, low power, S 12-/10-Bit Resolution ease of use, and small package size make these convert- ers ideal for portable battery-powered data-acquisition Applications applications, and for other applications that demand low High-Speed Data Acquisition Systems power consumption and small space. High-Speed Closed-Loop Systems The MAX11129MAX11132 are available in 28-pin, 5mm x 5mm, TQFN packages and the MAX11131 is available Industrial Control Systems in a 28-pin TSSOP package. All devices operate over the Medical Instrumentation -40NC to +125NC temperature range. Battery-Powered Instruments Portable Systems SampleSet and AutoShutdown are trademarks of Maxim Integrated Products, Inc. Ordering Information appears at end of data sheet. QSPI is a trademark of Motorola, Inc. MICROWIRE is a registered trademark of National For related parts and recommended products to use with this part, Semiconductor Corporation. refer to www.maximintegrated.com/MAX11129.related. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-6026 Rev 5 9/12MAX11129MAX11132 3Msps, Low-Power, Serial 12-/10-Bit, 8-/16-Channel ADCs ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +4V Continuous Power Dissipation (T = +70NC) DD A OVDD, AIN0AIN13, CNVST/AIN14, REF+, REF-/AIN15 TQFN (derate 34.4mW/NC above +70NC)..................2758mW to GND ......................-0.3V to the lower of (V + 0.3V) and +4V TSSOP (derate 27mW/NC above +70NC)...................2162mW DD Operating Temperature Range ........................ -40NC to +125NC CS, SCLK, DIN, DOUT, EOC TO GND ..... -0.3V to the Lower of Junction Temperature .....................................................+150NC (V + 0.3V) and +4V OVDD Storage Temperature Range ............................ -65NC to +150NC DGND to GND ......................................................-0.3V to +0.3V Lead Temperature (soldering, 10s) ................................+300NC Input/Output Current (all pins) ...........................................50mA Soldering Temperature (reflow) ......................................+260NC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN TSSOP Junction-to-Ambient Thermal Resistance (B ) ...........29NC/W Junction-to-Ambient Thermal Resistance (B ) ...........37NC/W JA JA Junction-to-Case Thermal Resistance (B ) ..................2NC/W Junction-to-Case Thermal Resistance (B ) ..................2NC/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (MAX11131/MAX11132) (V = 2.35V to 3.6V, V = 1.5V to 3.6V, f = 3Msps, f = 48MHz, 50% duty cycle, V = V , T = -40NC to +125NC, DD OVDD SAMPLE SCLK REF+ DD A unless otherwise noted. Typical values are at T = +25NC.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DC ACCURACY (Notes 3 and 4) Resolution RES 12 bit 12 Bits Integral Nonlinearity INL 1.0 LSB Differential Nonlinearity DNL No missing codes 1.0 LSB Offset Error -0.1 4.0 LSB Gain Error (Note 5) +0.3 4.0 LSB Offset Error Temperature OE 2 ppm/NC TC Coefficient Gain Temperature Coefficient GE 0.8 ppm/NC TC Channel-to-Channel Offset 0.5 LSB Matching Line Rejection PSR (Note 6) 0.5 2 LSB/V DYNAMIC PERFORMANCE (500kHz, input sine wave) (Notes 3 and 7) Signal-to-Noise Plus Distortion SINAD 70 72.2 dB Signal-to-Noise Ratio SNR 70 72.3 dB Total Harmonic Distortion THD -88 -78 dB (Up to the 5th Harmonic) Spurious-Free Dynamic Range SFDR 79 90 dB Intermodulation Distortion IMD f = 398.4375kHz, f = 275.8125kHz -85 dB 1 2 Maxim Integrated 2